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January 20, 2024
Category Connection: Máquina de limpieza del semiconductor
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Etiquetas:
#máquina de limpieza del semiconductor de 600m m #Máquina de limpieza del semiconductor del SC 820 #equipo de limpieza auto de 1650m m
Brief: Discover the SC610 Semiconductor Cleaning Machine, designed for in-line cleaning of chip semiconductor packaging. This advanced machine efficiently removes flux and other contaminants post-soldering, ensuring high-quality chip packaging. Ideal for lead frames, IGBT, IPM, and IC modules, the SC610 offers automated wash and rinse processes with precise control.
Related Product Features:
  • In-line cleaning for semicon chips during packaging process.
  • Spray cleaning to effectively remove flux and contaminants.
  • Automated chemical clean, DI water rinse, and hot air dry process.
  • Adjustable wash liquid spray pressure for different chip types.
  • High flow and pressure liquid for precise FC packaging chips.
  • DI water resistivity monitoring system for consistent quality.
  • PLC control system with English interface for user-friendly operation.
  • 304 stainless steel frame ensures durability and longevity.
Preguntas frecuentes:
  • What types of chips can the SC610 clean?
    The SC610 is designed to clean lead frames, IGBT, IPM, and IC modules chips during the packaging process.
  • How does the SC610 ensure cleaning precision?
    The machine features high flow and pressure liquid systems, adjustable spray pressure, and DI water resistivity monitoring for precise and consistent cleaning.
  • What are the key automation features of the SC610?
    The SC610 automates wash liquid and DI water add/discharge, includes a PLC control system, and offers real-time monitoring of wash liquid concentration and DI water resistivity.
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